Chip-to-Wafer Gang Bonding for High Throughput 3D-Integration

2019 International Conference on Solid State Devices and Materials

Sep 2, 2019 - Sep 5, 2019
Nagoya University

10:53 AM - 10:55 AM

^○M. Mariappan¹, T. Fukushima¹, A. Nakamura¹, J.C. Bea¹, M. Koyanagi¹ (1.Tohoku Univ. (Japan))