Efficient Heat Transfer by Through Silicon Via in 3D Packaging for Practical-scale Quantum Annealing Machine

2019 International Conference on Solid State Devices and Materials

Sep 2, 2019 - Sep 5, 2019
Nagoya University

11:19 AM - 11:21 AM

^○W. Feng¹, K. Kikuchi¹, M. Hidaka¹, H. Yamamori¹, Y. Araga¹, K. Makise¹, S. Kawabata¹ (1.AIST (Japan))