Evaluation of bending stress in Au-wiring formed over FHE by micro-XRD

Murugesan Mariappan

doi:https://doi.org/10.7567/SSDM.2020.C-5-04

15:00 〜 15:15

[C-5-04] Evaluation of bending stress in Au-wiring formed over FHE by micro-XRD

〇Murugesan Mariappan¹, Y Susumago¹, T Odashima¹, H Kino¹, T Tanaka¹, K Sumitani², Y Imai², S Kimura², T Fukushima¹ (1. Tohoku Univ(Japan), 2. JASRI(Japan))

https://doi.org/10.7567/SSDM.2020.C-5-04

2020 International Conference on Solid State Devices and Materials

[C-5-04] Evaluation of bending stress in Au-wiring formed over FHE by micro-XRD