15:15 〜 15:30

[C-9-05] Fabrication of Hollow Structure in Embedded Die Substrate for Heterogeneous Integration

〇Masamitsu Matsuura¹, Tanemasa Asano¹, Haruichi Kanaya¹ (1. Kyushu Univ.(Japan))

https://doi.org/10.7567/SSDM.2020.C-9-05