The 82nd JSAP Autumn Meeting 2021

Presentation information

Oral presentation

13 Semiconductors » 13.7 Compound and power devices, process technology and characterization

[11p-N305-1~10] 13.7 Compound and power devices, process technology and characterization

Sat. Sep 11, 2021 1:30 PM - 4:15 PM N305 (Oral)

Hiroshi Yano(Univ. of Tsukuba)

3:15 PM - 3:30 PM

[11p-N305-7] Operating Characteristics of Full 4H-SiC Pixel Device under UV-Light Irradiation

Shin-Ichiro Kuroki1, Kenta Nishigaito1, Tatsuya Meguro1, Akinori Takeyama2, Takeshi Ohshima2, Yasunori Tanaka3 (1.RNBS, Hiroshima Univ., 2.QST, 3.AIST)

Keywords:Silicon Carbide, CMOS image sensor, radiation hardened devices

Harsh einvironment electronics, which can be operable in high radiation or high temperature enviornments, has been required. Especially, for the decommissioning of the Fukushima Daiichi nuclear power station, radiation-hardened image sensors have been required. In this work, we developped a full 4H-SiC pixel device for radiation hardened UV CMOS image sensor, and investigated operating characteristics of the devices under UV-light irradiation.