[21a-C301-1~10] 3.12 半導体光デバイス（旧3.13）

▲ [21a-C301-7] 1060nm Single-mode Bottom Emitting VCSEL Array for Multi-core Fiber Co-packaged Optics Transceivers

〇(DC)Liang Dong¹、Xiaodong Gu¹、Fumio Koyama¹ (1.Tokyo Tech)

キーワード：VCSEL

We demonstrated 16-ch bottom emitting MA-VCSEL based on full 3-inch wafer process, enabling flip-chip bonding for use in compact CPO transceivers. The spacing between each adjacent VCSELs is 40 um and the total size of chip is as small as 1 mm². With the intra-cavity metal-aperture, single mode operations were obtained with large oxidation apertures of 6 um, which is important for high reliability. Also, the bandwidth enhancement was observed thanks to the coupled cavity effect.