The 70th JSAP Spring Meeting 2023

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Symposium (Oral)

Symposium » 【Open Symposium】Connection : From BEOL to Tiplet, and to the Future **In corporation with The Japan Institute of Electronics Packaging (JIEP)

[16a-E302-1~6] 【Open Symposium】Connection : From BEOL to Tiplet, and to the Future **In corporation with The Japan Institute of Electronics
Packaging (JIEP)

Thu. Mar 16, 2023 9:00 AM - 12:10 PM E302 (Building No. 12)

Noriaki Matsunaga(Applied Materials Japan), Yasumitsu Orii(Rapidus), Fumihiro Inoue(YNU)

11:40 AM - 12:10 PM

[16a-E302-6] Trends in Advanced Substrate Technologies for Semiconductor Packaging

〇Ryuichi Matsuki1, Shinji Nakazawa1, Kiyoshi Oi1, Noritaka Katagiri1, Yasushi Araki1 (1.SHINKO ELECTRIC INDUSTRIES)

Keywords:Semiconductor packaging, High density substrate, Organic interposer

This presentation will discuss trends in the development of semiconductor packaging substrates and organic interposer substrates for chiplet technology, which reintegrates functionally separated semiconductors onto a package, mainly from the perspective of signal transmission characteristics.