[C205-3am] 20. Materials Chemistry -Basic and Application-

[C205-3am-03] Analysis of organic additives in copper-plating bath by use of boron-doped diamond electrode

^○Taiga Taiga Saeki¹, Sachio Yoshihara¹ (1. The University of Utsunomiya)

[Lang.] Japanese

Keywords:Boron-doped diamond, Copper pyrophosphate plating bath, Quadrol, Electrochemical analysis