[K403-3pm] Colloidal Dispersion and Aggregation for Future Battery and Electronic Material Technologies

[K403-3pm-05] Particle Design for Copper-based Paste in Electronic Component and Electrodes : Low-Temperature Sintering and Oxidation Resistance

^○Hideya Kawasaki¹ (1. Kansai University)

[Lang.] Japanese

Keywords:copper paste, low temperature-sintering, oxidation resistance, electronic components