Session information

Technical Session(Special Session & Regular Session)

[B2 (Special Session)] Power Electronic Packages & Modules

Mon. Oct 1, 2018 1:20 PM - 3:20 PM Room 2 (Conference Center 301)

Chairs: Michiaki Hiyoshi (Hyundai Motor Japan R&D Center, Inc.), Jochen Langheim (EURIPIDES)

Technical Session(Special Session & Regular Session)

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[B2-1] High temperature operation of semi-conductor die attach by sintering of Ag3Sn material - Synthesis of submicron Ag3Sn particles by polyol chemistry as a new sintering material -

20189142

^○Jean-Michel Morelle¹, Ky Lim Tan¹, Roland Mahayri², Fréderic Schoenstein², Noureddine Jouini² (1.Valeo Group Electronics Expertise & Development Services, France, 2.LSPM, CNRS, France)

[B2-2] Development of TLP-Ai Technology to Reduce the Thermal Stress and Thermal Resistance of Power Modules

20189143

^○Rintaro Asai¹, Hirofumi Ito², Masanori Usui², Masaki Aoshima¹ (1.Toyota Motor Corporation, Japan, 2.TOYOTA CENTRAL R&D LABS., INC, Japan)

[B2-3] High-power-density DC/DC Converter using a Novel Coupled Inductor to Reduce the Leakage Fluxes for New Model Plug-in Hybrid Vehicle

20189144

^○Akitomo Komatsuzaki¹, Satoshi Hashino² (1.Honda R&D Co., Ltd., Japan, 2.Keihin Corporation,)

[B2-4] The high capacity power module with optimal package technology

20189145

^○Shoji Saito, Seiichiro Inokuchi, Shinji Hatae (Mitsubishi Electric Corporation, Japan)

[B2-5] Scalable Si IGBT power module solution for growing xEV market

20189146

^○Kenji Kawada (Infineon Technologies Japan KK)

[B2-6] Automotive Qualification Routines for Power Electronics’ Modules in Electrified Powertrains - The New ECPE Working Group‘AQG 324’Started Its Work -

20189147

Martin Rittner¹, Markus Thoben², Peter Dietrich³, Frank Heidemann⁴ (1.Robert Bosch GmbH, Germany, 2.Infineon Technologies AG, Germany, 3.Heraeus Deutschland GmbH & Co. KG, Germany, 4.SET GmbH, Germany)

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