High temperature operation of semi-conductor die attach by sintering of Ag3Sn material - Synthesis of submicron Ag3Sn particles by polyol chemistry as a new sintering material -

Jean-Michel Morelle

Presentation information

Technical Session(Special Session & Regular Session)

[B2 (Special Session)] Power Electronic Packages & Modules

Mon. Oct 1, 2018 1:20 PM - 3:20 PM Room 2 (Conference Center 301)

Chairs: Michiaki Hiyoshi (Hyundai Motor Japan R&D Center, Inc.), Jochen Langheim (EURIPIDES)

Technical Session(Special Session & Regular Session)

[B2-1] High temperature operation of semi-conductor die attach by sintering of Ag3Sn material - Synthesis of submicron Ag3Sn particles by polyol chemistry as a new sintering material -

20189142

^○Jean-Michel Morelle¹, Ky Lim Tan¹, Roland Mahayri², Fréderic Schoenstein², Noureddine Jouini² (1.Valeo Group Electronics Expertise & Development Services, France, 2.LSPM, CNRS, France)

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Presentation information

[B2 (Special Session)] Power Electronic Packages & Modules

[B2-1] High temperature operation of semi-conductor die attach by sintering of Ag3Sn material - Synthesis of submicron Ag3Sn particles by polyol chemistry as a new sintering material -

20189142

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