Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices

[Packaging II] Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices

Thu. Jun 30, 2022 10:40 AM - 12:00 PM Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices (A10)

Chairman:Sanjay Malik(FUJIFILM ELECTRONIC MATERIALS U.S.A.), Akira Watanabe(Tohoku University)

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10:40 AM - 11:00 AM

[3A1006] Highly stable flexible tactile pressure sensor array

*Haruki Nakamura¹, Seiji Wakabayashi¹, Satoko Honda¹, Takayuki Arie¹, Seiji Akita¹, Kuniharu Takei¹ (1. Osaka Prefecture University)

11:00 AM - 11:20 AM

[3A1007] “Stretchable and gas-impermeable packaging film for flexible battery using the liquid metal”

*Nyamjargal Ochirkhuyag¹, Satoru Mizuguchi¹, Yuuki Nishitai¹, Kazuhide Ueno¹, Hiroki Ota¹ (1. Yokohama National University )

11:20 AM - 11:40 AM

[3A1008] A breathable and stretchable sensor sheet design for wearable device

*YAN XUAN¹, Hyuga Hara¹, Satoko Honda¹, Yanpeng Li¹, Yusuke Fujita¹, Takayuki Arie¹, Seiji Akita¹, Kuniharu Takei¹ (1. Department of Physics and Electronics, Osaka Prefecture University)

11:40 AM - 12:00 PM

[3A1009] Transparent and breathable ion gel-based temperature and humidity selective sensors

*Yuji Isano¹, Hajime Fujita², Koki Murakami¹, Sijie Ni¹, Yuta Kurotaki¹, Tamami Takano¹, Yutaka Isoda¹, Ryosuke Matsuda¹, Fumika Nakamura¹, Yuuki Nishitai¹, Nyamjargal Ochirkhuyag¹, Kota Inoue¹, Hiroki Kawakami¹, Yusuke Okubo³, Kazuhide Ueno¹, Toshinori Fujie², Hiroki Ota¹ (1. Yokohama National University, 2. Tokyo Institute of Technology, 3. National Institute of Health Science)