Session information

Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices

[Packaging III] Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices

Thu. Jun 30, 2022 1:00 PM - 2:40 PM Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices (A10)

Chairman:Tetsuya Enomoto(Showa Denko Materials), Takumi Ueno(Shinshu University)

1:00 PM - 1:30 PM

*Masao Tomikawa¹ (1. Toray Industries Inc.)

1:30 PM - 1:50 PM

*Kazue Hirano¹ (1. Showa Denko Materials Co.,Ltd.)

1:50 PM - 2:10 PM

*Keigo Kato¹, Yoshiko Tatsuta¹, Kazuyuki Matsumura¹, Akira Shimada¹ (1. Toray Industries, Inc.)

2:10 PM - 2:40 PM

*Markus Woehrmann¹, Michael Schiffer¹, Martin Schneider-Ramelow² (1. Fraunhofer IZM, 2. Technical University of Berlin)