[G] 溶融・凝固プロセス 高温プロセス

[384] Splitting of small-angle grain boundaries during directional solidification of silicon

*荘 履中¹、前田 健作¹、志賀 敬次¹、森戸 春彦¹、藤原 航三¹ (1. 東北大金研)

キーワード：Grain boundary、Directional solidification、Multicrystalline silicon

The present study shows that small-angle grain boundaries, which composed of sets of dislocations, are able to split at the crystal/melt interface of silicon under certain conditions.