[G] Packaging Mechanics and other processes

[348] Fatigue Crack Propagation Testing of Sn-3.0Ag-0.5Cu / Cu Joints Using Miniature CT Specimens

*Toshiyuki MISU¹, Yoshiharu KARIYA², Hiroki KANAI¹ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology)

Keywords:Fatigue crack propagation、Solder joint、Power module、CT specimen

新たにはんだ合金用破壊力学試験片および疲労き裂進展試験方法を提案し，はんだ合金の疲労き裂進展則の取得を試みた．