[G] Packaging Mechanics and other processes

[349] Evaluation Method of Adhesive Fracture Energy of Interlayer Dielectric Film on Cu for Redistribution Layer of Semiconductor Package by　Shear Test

*Hironao KAWABE¹, Yoshiharu KARIYA², Makoto HARAGUCHI³, Taku OGAWA³, Hirokazu ITO³ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology, 3. JSR Corporation)

Keywords:Critical energy release rate、Delamination、Polymer、Shear test、Finite element method

シア試験により求めた絶縁膜とCu膜との界面の強度から，有限要素法を用いて擬似的に剥離靭性値を算出する方法を検討した．