一般講演

[G] Additive Manufacturing and Powder Metallurgy

Wed. Sep 21, 2022 10:00 AM - 12:30 PM Rm. P (C33,3Flr. Build.C)

座長:小泉雄一郎(大阪大学)、伊藤和博(大阪大学)

※表示の講演時間には質疑応答時間も含みます。
（質疑応答時間5分、基調講演と招待講演は5～10分）

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10:00 AM - 10:15 AM

[315] Effect of powder morphology on flowability and powder bed quality in powder bed fusion-based additive manufacturing process

*SEUNGKYUN YIM¹, HUAKANG BIAN¹, KENTA AOYAGI¹, AKIHIKO CHIBA¹ (1. IMR. Tohoku Univ.)

10:15 AM - 10:30 AM

[316] Effect of particle size distribution on segregation and packing density in powder spreading process of powder bed fusion-type additive manufacturing

*KOKI MINOWA¹, Seungkyun Yim², Kenta Aoyagi², Akihiko Chiba² (1. 東北大工（院生）、2. 東北大金研)

10:30 AM - 10:45 AM

[317] Effects of atmospheric pressure and heat source on melt pool geometry in powder bed fusion processes

*Naoko Sato^1,2, Yuchao Lei¹, Yufan Zhao³, Kenta Yamanaka¹, Akihiko Chiba¹ (1. Tohoku Univ., 2. AIST, 3. Tohoku Univ. (Present: NPU))

10:45 AM - 11:00 AM

[318] Detection of defects due to excessive heat input during additive manufacturing using AE monitoring

*Kaita ITO¹, Rinako KOKAJI², Masahiro KUSANO¹, Takayuki SHIRAIWA², Makoto WATANABE¹, Manabu ENOKI² (1. NIMS, 2. Univ. Tokyo)

11:00 AM - 11:15 AM

[319] Evaluation of the types of defects during laser powder bed fusion by AE method

*Rinako KOKAJI¹, Kaita ITO², Masahiro KUSANO², Takayuki SHIRAIWA¹, Makoto WATANABE², Manabu ENOKI¹ (1. The Univ. of Tokyo, 2. NIMS)

break （11:15 AM - 11:30 AM）

11:30 AM - 11:45 AM

[320] Study on additive manufacturing of CoCrNi medium entropy alloy by selective laser melting

*Haotian SUN¹, Zairan LUO², Hiroshi OKA¹, Shigrhito ISOBE¹, Shuai WANG², Naoyuki HASHIMOTO¹ (1. Hokkaido University、2. Southern University of Science and Technology)

11:45 AM - 12:00 PM

[321] Preparation of MXene with variable interlayer distance using combustion synthesis

*Ryuichi TOMOSHIGE¹, Yui NISHIYAMA², Hitoshi INOKAWA¹ (1. Sojo UIniv., 2. Sojo UIniv.)

12:00 PM - 12:15 PM

[322] Spark Plasma Sinterability of Nanostructured WC-Co Cemented Carbides Granulated Powder Designed for Laser Cladding

*Kanawat RATANAPONGPIEN^1,2, Motoko Yamada³, Hisashi Sato³, Yoshimi Watanabe³, Yorihiro Yamashita⁴, Takahiro Kunimine¹ (1. Kanazawa University, 2. King Mongkut’s University of Technology Thonburi, 3. Nagoya Institute of Technology, 4. National Institute of Technology, Ishikawa College)

12:15 PM - 12:30 PM

[323] Constant Temperature Forging of Inconel 718 Alloy Using Ti(C, N)-W Cermet Mold

*Takashi MURAKAMI¹, Masahito KATOH¹ (1. National Institute of Advanced Industrial Science and Technology)

一般講演

[G] Joining and Adhesive

Wed. Sep 21, 2022 1:30 PM - 5:15 PM Rm. P (C33,3Flr. Build.C)

Chair:Hajime Yamamoto(JWRI)

※表示の講演時間には質疑応答時間も含みます。
（質疑応答時間5分、基調講演と招待講演は5～10分）

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1:30 PM - 1:45 PM

[324] Research on Simulation Models of Resistance Spot Welding for Al/Steel Joint

*Hisashi SERIZAWA¹, Kakeru NARIHIRO¹ (1. Osaka Univ.)

1:45 PM - 2:00 PM

[325] Microstructure and Mechanical Properties of A6061/GA980 Resistance Spot Weld

*Toshiki NONOMURA¹, Tsuyoshi KOSAKA¹, Ikuo SHOHJI¹, Tatsuya KOBAYASHI¹, Muneyoshi IYOTA² (1. Graduate School of Science and Technology, Gunma Univ., 2. Osaka Institute of Technology)

2:00 PM - 2:15 PM

[326] Effect of Durability Improvement of Steel/Al alloy Adhesive Joints by Ti-based Conversion Treatment

*Tsuyoshi KOSAKA¹, Ikuo Shohji¹, Tatsuya Kobayashi¹ (1. Graduate School of Science and Technology, Gunma Univ.)

2:15 PM - 2:30 PM

[327] Effect of Deposition Process of Specially Shaped Electrodeposited and Undercoated Films on Metal/CFRTP Joining Properties

*Kohei YAMAZAKI¹, Ikuo SHOHJI¹, Tatsuya KOBAYASHI¹ (1. Graduate School of Science and Technology, Gunma Univ.)

2:30 PM - 2:45 PM

[328] Effect of specimen size on strength and fracture behavior of Si₃N₄/Nb/Ti-6Al-4V for ceramics/metal hybrid thruster

*Hikaru Kawase¹, Fei　Shen Ong², Hirobumi Tobe³, Eiichi Sato³, Koichi Kitazono⁴ (1. Tokyo Metropolitan University, System Design (Grad student), 2. The University of Tokyo, Engineering (Grad student), 3. ISAS/JAXA, 4. Tokyo Metropolitan University, System Design)

break （2:45 PM - 3:00 PM）

3:00 PM - 3:15 PM

[329] Compressive residual stress and retained austenite generated in the steel surface layer by friction stir processing with the WC tool

*Hajime Yamamoto¹, Yuji Yamamoto¹, Kazuhiro Ito¹, Yoshiki Mikami¹ (1. JWRI, Osaka Univ.)

3:15 PM - 3:30 PM

[330] Inhomogeneity of microstructure formed in stir zone of friction stir welded medium Mn steel

*Takayuki YAMASHITA¹, Kohsaku USHIODA¹, Hidetoshi FUJII¹ (1. JWRI, Osaka Univ.)

3:30 PM - 3:45 PM

[331] Microstructure of Ferritic Stainless Steel Brazed Joint with Cu-Mn-Ni Filler Metal

*Yuya MATSUO¹, Ikuo Shohji¹, Tatsuya Kobayashi¹, Junichiro Hirohashi², Katsufumi Inoue², Tsunehito Wake², Hiroki Yamamoto³ (1. Graduate School of Science and Technology, Gunma Univ., 2. Waki Factory Inc., 3. Kandori Industry)

3:45 PM - 4:00 PM

[332] Research on low-temperature bonding technology for stainless steel structural materials utilizing Ni micro-plating bonding

*Mayu MIYAGAWA¹, Tetsuya Uchimura¹, Keiko Koshiba¹, Tomonori Iizuka¹, Kohei Tatsumi¹ (1. Waseda Univ.)

break （4:00 PM - 4:15 PM）

4:15 PM - 4:30 PM

[333] Effect of Aging under High Temperature and High Humidity Conditions on Bond Strength of Al/Epoxy Resin Adhesion

*Itsuki WATANABE¹, Ikuo SHOHJI¹, Tatsuya KOBAYASHI¹ (1. Graduate School of Science and Technology Gunma University)

4:30 PM - 4:45 PM

[334] Prediction on Relaxation Characteristic of Ultraviolet Curable Adhesive in Curing Process

*Takahiro KODERA¹, Yoshiharu KARIYA² (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering Shibaura Institute of Technology)

4:45 PM - 5:00 PM

[335] Effect of bonding temperature on anodic bonding of borosilicate glasses using intermediate conductor layer

*MAKOTO TAKAHASHI¹ (1. JWRI, Osaka University)

5:00 PM - 5:15 PM

[34] Effect of Additional Element to Ag-based Filler on the Stainless Steel Brazed Joint

*Ryusuke KAMATA¹, Yasuyuki MIYAZAWA², Hiroaki HARA¹, Shouta NAKAJIMA¹, Susumu NISIWAKI (1. 東海大工、2. 東海大工（教授）)

一般講演

[G] Packaging (1)

Thu. Sep 22, 2022 9:00 AM - 11:15 AM Rm. P (C33,3Flr. Build.C)

Chair:Equo KOBAYASHI(Tokyo Inst. of Tech.)

※表示の講演時間には質疑応答時間も含みます。
（質疑応答時間5分、基調講演と招待講演は5～10分）

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9:00 AM - 9:15 AM

[336] Interfacial Reaction between Pd-Cu-Ni Alloy and Sn-58Bi Solder

*kazumi watarai¹, ikuo shohji¹, Tatsuya Kobayashi¹, Tomohisa Hoshino², kenichi sato², shunsuke kobayashi², naohito odani² (1. Graduate School of Science and Technology, Gunma Univ., 2. Yokowo Co., Ltd)

9:15 AM - 9:30 AM

[337] Effect of Ag and Ni addition in Sn-58Bi eutectic alloy

*Yuki Tanaka¹, Minho O², Equo Kobayashi² (1. Tokyo Institute of Technology（Master）, 2. Tokyo Institute of Technology)

9:30 AM - 9:45 AM

[338] Effect of MWCNT on the growth behavior of the compound at Sn-Ag-Cu solder joints

*Hiroka Iwamoto¹, Minho O², Equo Kobayashi² (1. Tokyo Institute of Technology (Master), 2. Tokyo Institute of Technology)

9:45 AM - 10:00 AM

[339] Effect of Addition of Sb on Ball Shear Strength of Joints with Sn-Ag-Cu Solder

*MARINA OYAMA¹, Ikuo Shohji², Tatsuya Kobayashi², Mohd　Arif Anuar　Mohd　Salleh³ (1. Gunma Univ, 2. Gunma Univ, 3. Universiti Malaysia Perlis)

break （10:00 AM - 10:15 AM）

10:15 AM - 10:30 AM

[340] Investigation of Formation Mechanism of Three-Dimensional Structure Ni-Cu Alloy Plating

*Thai　Anh PHAM¹, Ikuo Shohji¹, Tatsuya Kobayashi¹ (1. Gunma Univ.)

10:30 AM - 10:45 AM

[341] Galvanic Corrosion Behavior between Metal with Ni-Cu Alloy Plating Film and CFRTP

*Kei SHIMIZU¹, Ikuo SHOHJI¹, Tatsuya KOBAYASHI¹ (1. Gunma University Graduate School of Science and Technology)

10:45 AM - 11:00 AM

[342] Fabrication of High Temperature Solder by Zn-Al Particle Dispersion Electroplating

*Yuki ABIKO¹, Ikuo SHOHJI¹, Tatsuya KOBAYASHI¹ (1. Graduate School of Science and Technology Gunma University)

11:00 AM - 11:15 AM

[343] Fabrication and Evaluation of Lead-Free Solder by Tin-Cellulose Nanofibers Composite Plating

*Ayuki KOGURE¹, Ikuo SHOHJI¹, Tatsuya KOBAYASHI¹ (1. Graduate School of Science and Technology, Gunma Univ.)

一般講演

[G] Packaging Mechanics and other processes

Thu. Sep 22, 2022 12:30 PM - 3:45 PM Rm. P (C33,3Flr. Build.C)

Chair:Minho O(Tokyo Institute of Technology)

※表示の講演時間には質疑応答時間も含みます。
（質疑応答時間5分、基調講演と招待講演は5～10分）

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12:30 PM - 12:45 PM

[344] Effect of Microstructure on Static Mechanical Properties of Ag Sintered Body

*Tatsuki OTANI¹, Yoshiharu KARIYA², Koji SASAKI³ (1. Graduate School of Shibaura Institute of Technology., 2. Department of Materials Science and Engineering Shibaura Institute of Technology, 3. NAMICS Corporation)

12:45 PM - 1:00 PM

[345] Effect of Ga and Bi Addition on Thermal Fatigue Properties of Sn

*Naoyuki HAMADA¹ (1. Osaka Research Institute of Industrial Science and Technology)

1:00 PM - 1:15 PM

[346] Effect of Breakaway Stress on Creep and Thermal Fatigue Life of Sn-Ag-Cu Containing Solid Solution Elements

*Shin ONDA¹, Yoshiharu KARIYA² (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering Shibaura Institute of Technology)

break （1:15 PM - 1:30 PM）

1:30 PM - 1:45 PM

[347] Strength Analysis of Micro Adhesive Joints by Fracture Mechanics Approach

*kouki KIMURA¹, Yoshiharu KARIYA² (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering Shibaura Institute of Technology)

1:45 PM - 2:00 PM

[348] Fatigue Crack Propagation Testing of Sn-3.0Ag-0.5Cu / Cu Joints Using Miniature CT Specimens

*Toshiyuki MISU¹, Yoshiharu KARIYA², Hiroki KANAI¹ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology)

2:00 PM - 2:15 PM

[349] Evaluation Method of Adhesive Fracture Energy of Interlayer Dielectric Film on Cu for Redistribution Layer of Semiconductor Package by　Shear Test

*Hironao KAWABE¹, Yoshiharu KARIYA², Makoto HARAGUCHI³, Taku OGAWA³, Hirokazu ITO³ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology, 3. JSR Corporation)

2:15 PM - 2:30 PM

[350] Reproduction Analysis of Stress State of Die Attach Joints in Power Semiconductor Modules during Power Cycling

*Misaki WATANABE¹, Yoshiharu KARIYA² (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering Shibaura Institute of Technology)

break （2:30 PM - 2:45 PM）

2:45 PM - 3:00 PM

[351] Fabrication of Ni-CNF Composite Plated Film by Electroless Plating Method

*Wataru KAWANABE¹, Makoto IIOKA¹, Ikuo SHOHJI¹, Tatsuya KOBAYASHI¹ (1. Graduate School of Science and Technology Gunma University)

3:00 PM - 3:15 PM

[352] Study on Contact Resistance between Cu Wiring and Shield Film for Shield Packages

*Soichi Homma^1,2, Yuusuke Takano¹, Yusuke Akada¹, Takeshi Watanabe¹, Masatoshi Fukuda¹, Takashi Imoto¹, Hiroshi Nishikawa³ (1. Kioxia Corp., 2. Osaka Univ. Graduate School of Engineering, 3. Osaka Univ. Joining and Welding Research Institute)

3:15 PM - 3:30 PM

[353] Released Gas Analysis from Gold Leaf at Bonding Process on Traditional Craft KIRIKANE

*Osamu OHASHI¹, Takashi Harumoto², Takao Fukudome³, Azusa Kubota³, Hiroshi Onodera³, Takashi Kimura⁴, Kensau Aihara⁵, Hidetoshi Namiki⁵ (1. WELLBOND, 2. Tokyo Institute Technology, 3. JEOL, 4. NIMS(JEOL), 5. Tokyo Univ. of Arts)

3:30 PM - 3:45 PM

[354] Cutting temperature, cutting behavior and surface integrity of 0.45% carbon steel under high-speed machining

*Hyung-Won PARK¹, Masaki MATSUDA¹, Kanji ISHITAKA¹, Shinichi HUNASE¹, Atsushi TOMIZAWA¹, Jun YANAGIMOTO², Takashi UEDA³ (1. Komatsu University, 2. The University of Tokyo, 3. Kanazawa University)

Sessions

6.Materials Processing » Solid process/ Solid and welding process

[G] Additive Manufacturing and Powder Metallurgy

[G] Joining and Adhesive

[G] Packaging (1)

[G] Packaging Mechanics and other processes

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