[G] Packaging Mechanics and other processes

[350] Reproduction Analysis of Stress State of Die Attach Joints in Power Semiconductor Modules during Power Cycling

*Misaki WATANABE¹, Yoshiharu KARIYA² (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering Shibaura Institute of Technology)

Keywords:Power semiconductor device、Die attach joint、Power cycling、Finite element analysis

電気回路の発熱を考慮した電気−熱−構造弱連成解析を行い，パワーサイクル中のダイアタッチの応力状態を精査した．