日本金属学会2024年秋期(第175回)講演大会

Presentation information

一般講演

6.Materials Processing » Solid process/ Solid and welding process

[G] Solid process/ Solid and welding process

Fri. Sep 20, 2024 9:00 AM - 11:45 AM Room P (A302 3rd floor Building A Center for Education in Liberal Arts and Sciences)

Chair:Tatsuya Kobayashi, Shinji Fukumoto

10:30 AM - 10:45 AM

[388] Interfacial Reaction between Probe for Semiconductor Packages Inspection and Sn Solder

*Rin HASHIZUME1, Ikuo Shohji1, Tatsuya Kobayashi1, Tomohisa Hoshino2, Kenichi Sato2, Shunsuke Kobayashi2, Naohito Odani2 (1. Graduate School of Science and Technology, Gunma Univ., 2. Yokowo Co., Ltd)

Keywords:Sn、Pd-30Cu-29.5Ag-0.5Zn、Reaction Layer、Aging treatment、Probe

半導体の動作検査を繰り返し行うと, プローブ材にはんだが凝着して, プローブ材が損傷することがある. 本研究では, 反応の基本である純SnとPd-30Cu-29.5Ag-0.5Zn(mass%)の反応を調査した.

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