Interfacial Reaction between Probe for Semiconductor Packages Inspection and Sn Solder

Rin HASHIZUME

Presentation information

一般講演

6.Materials Processing » Solid process/ Solid and welding process

[G] Solid process/ Solid and welding process

Fri. Sep 20, 2024 9:00 AM - 11:45 AM Room P (A302 3rd floor Building A Center for Education in Liberal Arts and Sciences)

Chair:Tatsuya Kobayashi, Shinji Fukumoto

10:30 AM - 10:45 AM

[388] Interfacial Reaction between Probe for Semiconductor Packages Inspection and Sn Solder

*Rin HASHIZUME¹, Ikuo Shohji¹, Tatsuya Kobayashi¹, Tomohisa Hoshino², Kenichi Sato², Shunsuke Kobayashi², Naohito Odani² (1. Graduate School of Science and Technology, Gunma Univ., 2. Yokowo Co., Ltd)

Keywords:Sn、Pd-30Cu-29.5Ag-0.5Zn、Reaction Layer、Aging treatment、Probe

半導体の動作検査を繰り返し行うと, プローブ材にはんだが凝着して, プローブ材が損傷することがある. 本研究では, 反応の基本である純SnとPd-30Cu-29.5Ag-0.5Zn(mass%)の反応を調査した.

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