1:15 PM - 1:30 PM
[394] Effect of Ag Addition on Crack Propagation Behavior of Sn-Sb-Ag-Ni-Ge Solder Alloy
Keywords:Sn-Sb-Ag-Ni-Ge、Ag Addition、EBSD Analysis
本研究ではSn-Sb-Ag-Ni-Ge系合金の25℃, 175℃での疲労特性を調査し, 疲労き裂進展挙動にAg添加量が及ぼす影響を調査した.
一般講演
6.Materials Processing » Materials Processing
Fri. Sep 20, 2024 1:00 PM - 3:00 PM Room P (A302 3rd floor Building A Center for Education in Liberal Arts and Sciences)
Chair:(Osaka University), Shinji Fukumoto, (Gunma University), (Osaka University)
1:15 PM - 1:30 PM
Keywords:Sn-Sb-Ag-Ni-Ge、Ag Addition、EBSD Analysis