Effect of Ag Addition on Crack Propagation Behavior of Sn-Sb-Ag-Ni-Ge Solder Alloy

Presentation information

一般講演

6.Materials Processing » Materials Processing

[G] Implementation / Mounting / BrazingAdhesion / Bonding/

Fri. Sep 20, 2024 1:00 PM - 3:00 PM Room P (A302 3rd floor Building A Center for Education in Liberal Arts and Sciences)

Chair:(Osaka University), Shinji Fukumoto, (Gunma University), (Osaka University)

1:15 PM - 1:30 PM

*Kentaro Kawai¹, Tatsuya Kobayashi¹, Ikuo Shohji¹, Kohei Mitsui², Hirohiko Watanabe^1,2 (1. Gunma Univ., 2. FUJI ELECTRIC)

Keywords:Sn-Sb-Ag-Ni-Ge、Ag Addition、EBSD Analysis

本研究ではSn-Sb-Ag-Ni-Ge系合金の25℃, 175℃での疲労特性を調査し, 疲労き裂進展挙動にAg添加量が及ぼす影響を調査した.

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