[16p-C11-1~12] Challenge of next generation surface control on thehigh end semiconductor device in the industry

[16p-C11-1] Challenges of cleaning process design to the device structure using new materials

^○Hayato Iwamoto¹, Suguru Saito², Yoshiya Hagimoto¹ (Sony Corporation¹, Sony Semiconductor Corporation²)

Keywords:洗浄プロセス,新材料,ウェットプロセス