[19a-C10-1~9] 13.4 Interconnection technology

△ [19a-C10-8] Evaluation of Self-Assembly and Electrostatic Temporary Bonding for Chip-to-Wafer 3D Integration

^○(D)Hideto Hashiguchi¹, Takafumi Fukushima², Jicheol Bea², Hisashi Kino¹, Kang-Wook Lee², Tetsu Tanaka^1,3, Mitsumasa Koyanagi² (Dept. of Bioengineering and Robotics, Tohoku Univ.¹, New Industry Creation Hatchery Center (NICHe), Tohoku Univ.², Dept. of Biomedical Engineering, Tohoku Univ.³)

Keywords:三次元集積化技術