Effect of underlying metal on gold plating line fabricated on GaN

Presentation information

Oral presentation

14. Semiconductors B (Exploratory Materials, Physical Properties, Devices) » 14.3 Electron devices and Process technology

Thu. Sep 19, 2013 1:00 PM - 5:45 PM D7 (MK 3F-302)

3:00 PM - 3:15 PM

^○Kazuhiro Maeda¹, Koichiro Nishizawa¹, Toshihiko Shiga¹, Masayoshi Takemi¹ (Mitsubishi Electric Corp.¹)

Keywords:めっき,GaN,Au