The 74th JSAP Autumn Meeting,2013

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13. Semiconductors A (Silicon) » 13.6 Silicon devices / Integration technology

[20a-C8-1~12] 13.6 Silicon devices / Integration technology

Fri. Sep 20, 2013 9:00 AM - 12:15 PM C8 (TC3 2F-201)

9:30 AM - 9:45 AM

△ [20a-C8-3] Investigation of Mechanical-Stress Reduction in 3D IC with Room Temperature Curing Adhesive

○Hisashi Kino1, Takafumi Fukusima2, Mitsumasa Koyanagi2, Tetsu Tanaka1,3 (Tohoku Univ.1, Tohoku Univ.2, Tohoku Univ.3)

Keywords:三次元集積