9:30 AM - 9:45 AM
△ [20a-C8-3] Investigation of Mechanical-Stress Reduction in 3D IC with Room Temperature Curing Adhesive
Keywords:三次元集積
Oral presentation
13. Semiconductors A (Silicon) » 13.6 Silicon devices / Integration technology
Fri. Sep 20, 2013 9:00 AM - 12:15 PM C8 (TC3 2F-201)
9:30 AM - 9:45 AM
Keywords:三次元集積