Study on Fabrication Process Conditions of Micro-Spring Arrays for LSI Interconnection

Presentation information

Regular sessions(Oral presentation)

01. Applied Physics in General » 1.3 Novel technologies

Wed. Mar 27, 2013 1:30 PM - 4:15 PM B6 (K2 4F-1402)

^○Chinami Kaneshiro¹, Kyota Kishimoto¹ (Okinawa NCT¹)

Keywords:スプリングプローブ、弾性応力