The 60th JSAP Spring Meeting,2013

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Symposium(Oral presentation)

Symposium » ・Present and future of CMOS/MEMS integration

[27p-G9-1~5] Present and future of CMOS/MEMS integration

Wed. Mar 27, 2013 1:30 PM - 4:15 PM G9 (B5 2F-2203)

[27p-G9-2] ▲Bumpless 3D Interconnects for the Tera-scale Bandwidth and High Density Devices Equivalent to <10nm Node Scaling

○Takayuki Ohba1 (The Univ. of Tokyo1)

Keywords:Bumpless、3D、TSV