[28p-G9-1~18] 13.6 Silicon devices / Integration technology

[28p-G9-3] Adsorption of Pd nanoparticles catalyst in high aspect ratio through-Si vias for electroless deposition

^○Fumihiro Inoue¹, Tomohiro Shimizu¹, Hiroshi Miyake¹, Ryohei Arima¹, Toshihiko Ito², Hirofumi Seki², Yuko Shinozaki², Tomohiko Yamamoto², Shoso Shingubara¹ (Kansai Univ.¹, Toray Research Center Inc.²)

Keywords:TSV、無電解めっき、バリアメタル