The 60th JSAP Spring Meeting,2013

Presentation information

Regular sessions(Oral presentation)

13. Semiconductors A (Silicon) » 13.6 Silicon devices / Integration technology

[28p-G9-1~18] 13.6 Silicon devices / Integration technology

Thu. Mar 28, 2013 1:30 PM - 6:30 PM G9 (B5 2F-2203)

[28p-G9-4] △Chip-to-Wafer 3D Integration Technology Using Chip Self-Assembly and Electrostatic Temporary Bonding

○(M2)Hideto Hashiguchi1, Takafumi Fukushima2, Jicheol Bea2, Murugesan Mariappan2, Hisashi Kino1, Kang-Wook Lee2, Tetsu Tanaka1, 3, Mitsumasa Koyanagi2 (Dept. of Bioengineering and Robotics, Tohoku Univ.1, NICHe2, Dept. of Biomedical Engineering, Tohoku Univ.3)

Keywords:三次元集積化技術