[28p-G9-1~18] 13.6 Silicon devices / Integration technology

[28p-G9-4] △Chip-to-Wafer 3D Integration Technology Using Chip Self-Assembly and Electrostatic Temporary Bonding

^○（M2）Hideto Hashiguchi¹, Takafumi Fukushima², Jicheol Bea², Murugesan Mariappan², Hisashi Kino¹, Kang-Wook Lee², Tetsu Tanaka^{1, 3}, Mitsumasa Koyanagi² (Dept. of Bioengineering and Robotics, Tohoku Univ.¹, NICHe², Dept. of Biomedical Engineering, Tohoku Univ.³)

Keywords:三次元集積化技術