The 60th JSAP Spring Meeting,2013

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Regular sessions(Oral presentation)

14. Semiconductors B (Exploratory Materials, Physical Properties, Devices) » 14.3 Electron devices and Process technology

[29a-G11-1~8] 14.3 Electron devices and Process technology

Fri. Mar 29, 2013 9:30 AM - 11:30 AM G11 (B5 2F-2205)

[29a-G11-8] △Backside Copper metallization technologies of GaAs devices

○Daisuke Tsunami1, Koichiro Nishizawa1, Toshihiko Shiga1, Tomoki Oku1, Masayoshi Takemi1 (Mitsubishi Electric Corp.1)

Keywords:化合物半導体、銅、めっき