[29a-G7-1~11] 22.1Joint Session L "Basics and applications of MEMS, NEMS: Integration of diverse functionalities"

[29a-G7-4] △Bonding Strength of Si Chip Bonded on Plastic Film by Ultrasonic Bonding of Compliant Bump

^○（D）Takanori Shuto¹, Keiichiro Iwanabe¹, Kazuhiro Noda², Seiya Nakai², Tanemasa Asano¹ (Kyushu Univ.¹, Adwelds²)

Keywords:常温実装、接合、フレキシブル