[29a-G7-1~11] 22.1Joint Session L "Basics and applications of MEMS, NEMS: Integration of diverse functionalities"

[29a-G7-5] Direct bonding of metal/dielectric substrate using surface activation treatment

^○Kei Hagiwara¹, Masahide Goto^1,2, Hiroshi Ohtake¹, Yoshinori Iguchi¹, Takuya Saraya², Hiroshi Toshiyoshi², Eiji Higurashi², Toshiro Hiramoto² (NHK STRL¹, Univ. of Tokyo²)

Keywords:接合、表面活性化