The 60th JSAP Spring Meeting,2013

Presentation information

Regular sessions(Oral presentation)

13. Semiconductors A (Silicon) » 13.4 Interconnection technology

[30a-G6-1~11] 13.4 Interconnection technology

Sat. Mar 30, 2013 9:00 AM - 12:00 PM G6 (B5 1F-2106)

[30a-G6-7] Properties of HfNx films as a barrier material for TSV interconnects

Masaru Sato1, Mayumi Takeyama1, Atsushi Noya1 (Kitami Inst. of Technol.1)

Keywords:バリヤ