[30a-G6-7] Properties of HfNx films as a barrier material for TSV interconnects
Keywords:バリヤ
Regular sessions(Oral presentation)
13. Semiconductors A (Silicon) » 13.4 Interconnection technology
Sat. Mar 30, 2013 9:00 AM - 12:00 PM G6 (B5 1F-2106)
Keywords:バリヤ