[18a-A19-1~13] 13.3 Si Process・Interconnect・MEMS・Integration

[18a-A19-13] Fabrication of Pixel Circuits for 3D-Structured CMOS Image Sensors

^○Masahide Goto¹, Kei Hagiwara¹, Yoshinori Iguchi¹, Hiroshi Ohtake¹, Takuya Saraya², Eiji Higurashi², Hiroshi Toshiyoshi², Toshiro Hiramoto² (NHK STRL¹, Univ. of Tokyo²)

Keywords:イメージセンサ,3D積層,SOI