[18a-A19-1~13] 13.3 Si Process・Interconnect・MEMS・Integration

[18a-A19-9] Fabrication of VGA Size Near-Infrared Image Sensor Using Room-Temperature Bonding Technology

^○(DC)Takanori Shuto¹, Keiichiro Iwanabe¹, Mutsuo Ogura², Katsuhiko Nishida², Tanemasa Asano¹ (Kyushu Univ.¹, IRspec²)

Keywords:常温接合,超音波接合,イメージセンサー