The 75th JSAP Autumn Meeting, 2014

Presentation information

Oral presentation

13. Semiconductors A (Silicon) » 13.3 Si Process・Interconnect・MEMS・Integration

[18p-A19-1~14] 13.3 Si Process・Interconnect・MEMS・Integration

Thu. Sep 18, 2014 2:00 PM - 5:45 PM A19 (E311)

5:00 PM - 5:15 PM

[18p-A19-12] Mesh-like silicon tactile imager with integrated thermal conductivity sensor for realization of material discrimination

Ryota Osugi1, Yusuke Takagi1, Yusaku Maeda1, Kyohei Terao1, Takaaki Suzuki1, Husao Shimokawa1, Hidekuni Takao1 (Kagawa University1)

Keywords:触覚センサ,熱伝導率