The 75th JSAP Autumn Meeting, 2014

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Oral presentation

13. Semiconductors A (Silicon) » 13.3 Si Process・Interconnect・MEMS・Integration

[18p-A19-1~14] 13.3 Si Process・Interconnect・MEMS・Integration

Thu. Sep 18, 2014 2:00 PM - 5:45 PM A19 (E311)

5:15 PM - 5:30 PM

[18p-A19-13] Proof Mass Formation Using Cu-Electroplating For Piezoelectric MEMS Vibration Energy Harvesters

○Shuichi Murakami1, Kento Kariya2, Takeshi Yoshimura2, Takayuki Nagataki1, Takuo Nakade1, Kazuo Satoh1, Norifumi Fujimura2 (TRI-Osaka1, Osaka Pref. Univ.2)

Keywords:振動発電,MEMS,めっき