The 75th JSAP Autumn Meeting, 2014

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13. Semiconductors A (Silicon) » 13.3 Si Process・Interconnect・MEMS・Integration

[18p-A19-1~14] 13.3 Si Process・Interconnect・MEMS・Integration

Thu. Sep 18, 2014 2:00 PM - 5:45 PM A19 (E311)

5:30 PM - 5:45 PM

[18p-A19-14] Wafer level vacuum packaging by anodic bonding with aluminum thin film

○Satoshi Karasawa1, Takeshi Sugiyama1, Tange Yoshihisa1, Hideshi Hamada1, Yoshifumi Yoshida1 (Seiko Instruments Inc.1)

Keywords:ウェハ接合