[19p-A19-1~15] 13.3 Si Process・Interconnect・MEMS・Integration

[19p-A19-11] Development of taper etching for low cost TSV.

^○Toshiyuki Sakuishi^1,2, Takahide Murayama^1,2, Yasuhiro Morikawa^1,2 (ULVAC.Inc.¹, NMEMS²)

Keywords:TSV,エッチング,パッケージング