[19p-A19-1~15] 13.3 Si Process・Interconnect・MEMS・Integration

[19p-A19-12] Directly Depth Measurement Tool of High Aspect Ratio Via Hole for Three Dimension Stacked Device

^○Makoto Nakamura¹, Hideki Kitada¹, Seiki Sakuyama¹ (FUJITSU LIMITED¹)

Keywords:TSV, 深さ, 高アスペクト, 直接計測, 分光干渉, 高速