[19p-A19-1~15] 13.3 Si Process・Interconnect・MEMS・Integration

[19p-A19-14] Thermal Deformation of Thin Si Chip With Redistribution Layer

^○Aki Dote¹, Masaru Morita¹, Hideki Kitada¹, Yoriko Mizushima², Seiki Sakuyama¹ (Fujitsu¹, Fujitsu Lab.²)

Keywords:熱変形,再配線,薄化Si