The 75th JSAP Autumn Meeting, 2014

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13. Semiconductors A (Silicon) » 13.3 Si Process・Interconnect・MEMS・Integration

[19p-A19-1~15] 13.3 Si Process・Interconnect・MEMS・Integration

Fri. Sep 19, 2014 2:00 PM - 6:00 PM A19 (E311)

3:00 PM - 3:15 PM

[19p-A19-5] Novel low-temperature decomposable fluorine free precursors for copper interconnect

Hiroshi Sudoh1, Masato Ishikawa1, ○Hideaki Machida1, Rasadujjaman Md2, Kondoh Eiichi2 (Gas-phase Growth Ltd.1, University of Yamanashi2)

Keywords:銅配線,SFCD,低温分解