The 75th JSAP Autumn Meeting, 2014

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Oral presentation

13. Semiconductors A (Silicon) » 13.3 Si Process・Interconnect・MEMS・Integration

[19p-A19-1~15] 13.3 Si Process・Interconnect・MEMS・Integration

Fri. Sep 19, 2014 2:00 PM - 6:00 PM A19 (E311)

3:30 PM - 3:45 PM

[19p-A19-7] Novel deposition apparatus for wafer-scale Cu deposition utilizing differential pressure

○Mitsuhiro Watanabe1, Takahiro Ueno1, Eiichi Kondoh1, Satoshi Yamamoto2, Tatsuo Suemasu2 (Univ. Yamanashi1, Fujikura Ltd.2)

Keywords:超臨界流体,薄膜堆積,銅