The 61st JSAP Spring Meeting, 2014

Presentation information

Symposium

Symposium planned by Program Committee » Flexible Electronics

[18p-D9-1~6] Flexible Electronics

Tue. Mar 18, 2014 1:30 PM - 4:30 PM D9 (D315)

1:30 PM - 2:00 PM

[18p-D9-1] Aerosol Deposition Method, Application to Flexible Components and Devices

Jun Akedo1, Muneyasu Suzuki1, Singo Hirose1, So Baba1 (AIST1)

Keywords:エアロゾルデポジション,セラミックコーティング