[18p-D9-1~6] Flexible Electronics

▲ [18p-D9-2] Low Coefficient of Linear Thermal Expansion Polyimide Film for Device Substrate.

^○Tetsuo Okuyama¹, Kousuke Sasai¹, Katsuki Nakase¹, Kazuyuki Oya¹, Muneatsu Nakamura¹ (Toyobo Co., Ltd Research Center¹)

Keywords:ポリイミド　,フレキシブル,CTE