[18p-E14-1~21] 13.3 Si Process・Interconnect・MEMS・Integration

[18p-E14-6] Photo-Patternable Materials for Low Temperature Bonding and Thick Microfluidic Channel Fabrication

^○Katsuhiko Hieda¹, Hiroshi Yamaguchi¹, Zen Komiya¹, Tomokazu Miyazaki², Sara Peeters², John O‘Callghan³, Karolien Jans³, Chengxun Liu³, Liesbet Lagae³, Paru Deshpande³ (JSR Corporation¹, JSRMicro N.V.², IMEC³)

Keywords:マイクロ流路,低温接着剤,感光性材料